Welcome to TradeFord.com, Join Free | Sign In | Premium Services
Home Trade Events Japan Packaging Supplies Ic Packaging Technology Expo

Ic Packaging Technology Expo

Date:
2013-01-16 to 2013-01-18
Venue:
Tokyo International Exhibition Center (Tokyo Big Sight)
Location:
Tokyo, Japan

Event Info:
Ic Packaging Technology Expo is going to be held on 2013-01-16 to 2013-01-18 at Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan organized by Reed Exhibitions Japan Limited, a renown event organizer of Packaging Supplies trade events.

Main focus of exhibition is Packaging Supplies industry. All professionals & companies who belongs to Packaging Supplies industry are welcome to participate in it at Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan.

Event Organizer

Reed Exhibitions Japan Limited
18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku -, Tokyo, Japan, Japan
Phone: +81-3-33498501
Fax: +81-3-33498599

Trade Events, Trade Shows & Exhibitions are now the most effective medium for the Global Suppliers and Manufacturers to reach the genuine buyers/importers and understand their needs & preference.

TradeFord is a growing B2B Marketplace
& Manufacturer Directory connecting
global Importers, Exporters, Buyers, Suppliers, Manufacturers & Traders at a reliable, common platform.